March 28, 2025, Shanghai – SEMICON China 2025 concluded today at Shanghai New International Expo Centre after three days (March 26-28). As the semiconductor industry’s premier global event, it attracted 500+ exhibitors and hundreds of thousands of professionals, collectively witnessing frontier technology breakthroughs and ecosystem evolution.

PSR demonstrated China’s innovation in advanced process equipment through its proprietary atomic-layer deposition (ALD) and application-specific epitaxy systems. Its full-spectrum exhibition of thin-film deposition technologies drove extensive engagements with global attendees and industry experts.

Precision Engineering, Advanced Innovation

Our global R&D team – led by 10+ overseas PhDs including 5 national talent awardees – delivers foundational innovations in thin-film deposition.

We specialize in proprietary ALD, PECVD and application-specific epitaxy systems. Our competitive portfolio spans Thermal ALD (tALD), Plasma Enhanced ALD (PEALD), Si/SiC Epitaxy, and PECVD platforms for high-end ICs, power devices, RF components, and advanced packaging.

Exhibition Highlights: Flagship Systems

Two PSR systems commanded center stage:

Spritz thermal ALD：Applications: HKMG metal layers, NAND WL/DRAM bWL films, SN gap-fill

Breakthroughs: Advanced gas delivery/distribution system improves film uniformity (±1.5%), reduces particles 40%, increases throughput 25%, and lowers CoO 30% vs. previous gen.

Applications: Advanced-node patterning, dielectric gap-fill for ICs/advanced packaging

Advantages: Miniaturized chamber with optimized flow-thermal-RF design achieves superior film quality (RRMS<0.15nm), chamber matching (±1.8%), and 99.2% uptime for HVM.

PSR remains committed to advancing thin-film deposition and specialty process technologies. We accelerate semiconductor equipment evolution through core innovation and invite global partners to co-create manufacturing roadmaps. Join us at SEMICON China 2026!