From March 26 to 28, 2025, the three-day SEMICON CHINA 2025 came to an end today at the Shanghai New International Expo Center. As an annual event for the global semiconductor industry, this exhibition attracted more than 500 exhibitors and hundreds of thousands of professional visitors to witness breakthroughs in cutting-edge semiconductor technologies and industrial ecology upgrades.
Pioneer Semiconductor focuses on high-end thin film deposition equipment independently developed by atomic layer deposition and characteristic epitaxial, showing the innovative strength of domestic high-end process equipment to the world. During the exhibition, Pioneer Semiconductor fully demonstrated cutting-edge technologies and products in the field of thin film deposition, which triggered many audiences to stop and communicate with industry professionals.
Focus on high-end processes and build innovative technologies
Pioneer Semiconductor has a multinational R&D team that gathers top talents in the field of global thin film deposition equipment. The core members are led by more than 10 overseas doctors and 5 people have been selected into the national talent program, laying a solid foundation for technological innovation.
The company focuses on high-end ALD, PECVD and characteristic epitaxial equipment technologies, and produces products with independent intellectual property rights and international competitiveness, covering core technologies such as tALD, PEALD, SI EPI, SiC EPI, PECVD, etc. The products are widely used in high-end integrated circuits, power devices, radio frequency components and advanced packaging fields.
Highlights of the exhibition: Celebrity equipment appears
At this exhibition, Pioneer Semiconductor two star devices - Thermal ALD and PEALD became the focus of the scene:
Spritz thermal ALD: widely used in HKMG metal layer deposition, NAND WL, DRAM bWL and SN regions thin film filling. It is equipped with advanced air intake, mixing systems and uniform flow systems, which greatly improves film uniformity and reduces particle generation, improves the production capacity and stability of the equipment, and greatly reduces the cost of customers.
Auratus PEALD: widely used in graphical product applications and dielectric film filling in high-end integrated circuits and advanced packaging. With the ultimate ALD small cavity, optimized flow field, heat field and RF circuit design have excellent performance in film formation film quality, stability, inter-cavity matching and cost, providing customers with efficient and stable mass production solutions for integrated circuits and advanced packaging.
Looking ahead, Pioneer Semiconductor will continue to maintain its original intention, continue to focus on the fields of thin film deposition and characteristic processes, and drive the upgrading of the semiconductor equipment industry with technological innovation. We look forward to working with global industrial chain partners to draw a blueprint for the future of semiconductor manufacturing! See you next year~