Auratus Plasma-Enhanced Atomic Layer Deposition (PEALD) System,mounted on the PSR twin-chamber platform Celeritas-8, processes up to 8 wafers simultaneously,meeting the demands for high productivity and high film quality.Auratus PEALD system,with extremely small ALD chambers,optimized flow field,thermal field,and RF circuit design,offers advantages such as high stability,high chamber to chamber matching performance,high utilization,and low precursor consumption. Providing an efficient and stable solution for customers in the integrated circuit and advanced packaging industries.
