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Auroalis Series

Plasma Enhanced Chemical Vapor Deposition

Auroalis Plasma-Enhanced Chemical Vapor Deposition(PECVD) System,mountedonthePSRtwin-chamberplatform Celeritas-8, processes up to8wafers simultaneously,meeting the demands for high productivity and high film quality.Auroalis series of productsensureshighprocessstabilitythroughoptimized flow field,thermal field,and RF circuit designs; ceramic heater provides a solution to thewaferwarping issue; and optimization of chamber component materials and surface treatment processes effectivelylowers particles.Auroalis provides solutionsfor a widerangeofcustomersfromplanar architecture tohigh aspect ratio3Dstructures,formultiple device types and processnodes.

Market application

  • Logic
  • DRAM
  • 3D NAND
  • Semiconductor Advaced Packaging
  • CIS

Core advantages

Wafer warping and particle control;

Optimized RF circuit design;

Simulation-based thermal and flow field design;

Software design focusing on human-computer interactionexperience;

Unified platform for multiple products,reducing learning andmaintenance costs.