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Spritz

Showerhead Thermal Atomic Layer Deposition

Spritz Thermal ALD is based on a showerhead dual-chamber design, combined with the high-throughput Celeritas-8 transfer module and the intelligent Exsequisoftware platform, which greatly enhances the through-put and stability of the system. Additionally, Spritz is equipped with advanced intake, mixing, and gas distribution systems that greatly improve film uniformity and reduce particle generation. The multi-zone temperature control system effectively reduces particle generation in the showerhead area, while in-situ cleaning extends chamber life and significantly lowers customer operating costs.

 

Spritz can be widely used for HKMG metal layer deposition such as pMetal/nMetal/Metal contacts, NAND WL, DRAM bWL and film deposition for storage node area.

Market Applications

  • High-k/Metal Gate (HKMG)
  • Buried Word Line (bWL), Storage Node (SN) Gapfill
  • Word Line (WL)
  • CMOS Image Sensors
  • Deep Trench Capacitor (DTC)
  • Metal-Insulator-Metal Capacitor (MIM)

Key Advantages

Dual-chamber design, with a through-put that is twice that of similar products in the industry, and reduces user costs

Mounted on the high-capacity dual-chamber Celeritas-8 platform to meet the high through-put requirements of DCM

The intelligent Exsequi software platform enables equipment fingerprint collection, monitoring and early warning, SPC and Trend Log correlation analysis

Through DOE, it can achieve industry-leading film uniformity, metal contamination, impurity levels, step coverage, and device performance

In-situ cleaning can achieve three times the chamber life time and lower the particle contamination effectively

Various hardware CIPs can further improve film uniformity and productivity, reaching the world-leading level