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Fluxus Series

Cross Flow Thermal Atomic Layer Deposition

Fluxus tALD is featuring an innovative crossflow dual-chamber design combined with the high-throughput twin-chamber Celeritas-8 transfer module and the intelligent Exsequi software platform,which greatly enhances the through-put and stability of the system.Additionally,Fluxus tALD is equipped with various advanced key components that significantly improve chamber stability,film uniformity,and chamber life time.For instance,the most advanced solid source delivery system ensures the stability of the precursor delivery,and the Wafer Indexing system effectively aids in improving film uniformity. Fluxus tALD can be widely used for film deposition in Logic FEOL High-k/Dipole and DRAM Peri High-k/Dipole applications.

Market application

  • Logic FEOL High-k/Dipole
  • DRAM Peri High-k
  • CIS
  • MIM

Core advantages

Dual-chamber design,with a through-put that is twice that of similar products in the industry;

Mounted on the high-capacity dual-chamber Celeritas-8 platform to meet the high through-put requirements of DCM;

The intelligent Exsequi software platform enables equipment fingerprint collection,monitoring and early warning,SPC and Trend Log correlation analysis;

The precursor delivery system utilizes the industry's most advanced solid source delivery system,effectively improving the stability of reaction source transport;

Through DOE,it can achieve industry-leading film uniformity, metal contamination,impurity levels,step coverage,and device performance;

Key chamber components have undergone key surface ehancement,extending the reaction chamber's lifespan to an industry-leading level.