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Fluxus

Crossflow Thermal Atomic Layer Deposition

Fluxus is featuring an innovative crossflow dual-chamber design combined with the high-throughput Celeritas-8 transfer module and the intelligent Exsequi software platform, which greatly enhances the through-put and stability of the system. Additionally, Fluxus is equipped with various advanced key components that significantly improve chamber stability, film uniformity, and chamber life time. For instance, the most advanced solid source delivery system ensures the stability of the precursor delivery, and the Wafer Indexing system effectively aids in improving film uniformity.

Fluxus can be widely used for film deposition in Logic FEOL High-k/Dipole and DRAM Peri High-k/Dipole applications.

Market Applications

  • High-k / Dipole Layer Engineering
  • High-k Dielectric Integration
  • CMOS Image Sensor Fabrication
  • Metal-Insulator-Metal (MIM) Capacitors

Key Advantages

Dual-chamber design, with a through-put that is twice that of similar products in the industry

Mounted on the high-capacity dual-chamber Celeritas-8 platform to meet the high through-put requirements of DCM

The intelligent Exsequi software platform enables equipment fingerprint collection, monitoring and early warning, SPC and Trend Log correlation analysis

The precursor delivery system utilizes the industry's most advanced solid source delivery system, effectively improving the stability of reaction source transport

Through DOE, it can achieve industry-leading film uniformity, metal contamination, impurity levels, step coverage, and device performance

Key chamber components have undergone enhanced surface treatment, extending the reaction chamber's lifespan to an industry-leading level