PSR’s self-developed equipment meets the high demands of AI, 5G/6G, and HPC for advanced packaging technologies, including Flip-Chip Bumping, Fan-Out, WLCSP, and 2.5D/3D TSV.
Product Portfolio
PSR’s self-developed equipment meets the high demands of AI, 5G/6G, and HPC for advanced packaging technologies, including Flip-Chip Bumping, Fan-Out, WLCSP, and 2.5D/3D TSV.
