Dear colleagues in the industry:
Hello!
The 12th Semiconductor Equipment and Core Components Exhibition (CSEAC2024) will be grandly held at the Wuxi Expo Center from September 25 to 27. Here, we sincerely invite you to take the time to visit this conference.
Pioneer Semiconductor is committed to building a platform-based semiconductor equipment company. This conference will focus on the cutting-edge fields of high-end semiconductor thin-film equipment and discuss industry development with you.
We are eagerly looking forward to you and your team to visit, share with us the latest achievements in the semiconductor equipment and core components industry, explore cooperation opportunities, and look forward to gathering with you at this conference!
Exhibition meeting schedule
9/25 Topic V: Chairman's Forum on Semiconductor Manufacturing and Equipment
Pioneer Chairman Lin Bo
Location: Hall A3; Speech Time: 15:55-16:15
Speech topic
Opportunities and Challenges of High-End Semiconductor Deposition Equipment in Chip Manufacturing
9/25 Special Event: New Product Release Conference
Pioneer Device VP Luo Bo
Location: Hall A3; Speech time: 10:45-11:10
Speech topic
12 Inch ATM Epitaxy Equipment and its Application in Silicon Wafer Manufacturing and Sepcialty Process
9/26 Topic 9: Forum on the linkage development of manufacturing technology and semiconductor equipment industry chain
Pioneer Device VP Wang Bo
Location: Hall B1; Speech time: 11:30-11:50
Speech topic
Exploration of the Localization of Metal Materials Based on Atomic Layer Deposition
Dizhiyan Thinking·Jiweicheng
Pioneer (Jiangsu) Semiconductor Technology Co., Ltd.
Pioneer (Jiangsu) Semiconductor Technology Co., Ltd. (referred to as "Pioneer Semiconductor") was established in 2022 and is located in Wuxi Economic Development Zone.
The company is committed to the research and development, production and sales of semiconductor equipment with independent intellectual property rights and internationally competitive advantages, focusing on the research and development of equipment and process technologies such as atomic layer deposition (ALD), Si epitaxial deposition (SI EPI), plasma chemical vapor deposition (PECVD), SiC epitaxial (SiC EPI) and atomic layer etching (ALE).
The company's goal is to solve the problems of deposition and etching technology in high-end chip manufacturing, lead more advanced deposition and etching equipment technology, and at the same time, work closely with the upstream and downstream industrial chains to move forward, helping China's semiconductor industry accelerate its takeoff!